Interaction of Polycrystalline Copper Films with Dilute Aqueous Solutions of Cupric Chloride.

摘要

In the electronics industry, thin films of copper deposited on substrates are used as electrically conductive paths to interconnect semiconductor devices and other computer components. The dissolution of copper in a dilute aqueous cupric chloride solution was studied to achieve an understanding of the role microstructure plays in the dissolution process. A multi-technique approach was taken using combinations of solution chemistry, computer modeling, and microstructural characterization techniques to analyze as-received samples and to monitor the dissolution process. This latter approach allowed reaction rates and activation energies to be calculated from speciation concentrations derived from computer modeling of known thermochemical reactions. In conjunction with the solution analysis, surface techniques were used to analyze the concentration distribution of the various elements after sample exposure to the etchant. The etching characteristics of the polycrystalline thin copper films are dependent on the film's microstructure. A procedure is suggested that will aid future researchers in the correlation of microstructure and dissolution characteristics of different copper samples prior to mass production of metallization for microelectronic circuits. (aw)