Experiments on Liquid Immersion Natural Convection Cooling of Leadless Chip Carriers Mounted on Ceramic Substrate.

摘要

An experimental investigation of natural convection heat transfer from a commercially available semiconductor device package is presented. The package was centrally mounted on a ceramic substrate. The package-substrate assembly formed one surface of a dielectric-filled cubical enclosure of aspect ratio one. The top surface of the enclosure was maintained at prescribed temperature. Surface temperature measurements were made at various locations on the substrate, the package lid, as well as the chip center. These measurements are reported for three dielectric fluids and three enclosures top surface temperatures, both with the substrate oriented horizontally as well as vertically. The results indicate that the maximum input power without exceeding a chip junction temperature of 80 C is 2.58 watts with FC-75 as the cooling fluid and the upper boundary maintained at 15 C. This is significantly larger than the maximum of 1.21 watts allowable with the natural convection air cooling. Keywords: Theses; Heat transfer; Heat conductance; Leadless chip carriers; Liquid immersion; Cooling natural convection. (kt)