Mechanical Properties of Microelectronics Thin Films: Silicon Nitride (Si3N4).

摘要

Mechanical design of microfabricated devices requires knowledge of mechanical material properties. Thin film material properties are sensitively process dependent, and should therefore be organized accordingly. A relational database of material properties is under development as part of a general micro-electro-mechanical computer aided design environment. A computerized literature search through the published values for Silicon Nitride (Si3N4) properties under various processing conditions resulted in the following document. Keywords: Micromechanical analysis, Deformable structures. (KR)