首页> 美国政府科技报告 >Investigation into the Use of 3D Scanning and Printing Technologies in the Navy Collaborative Product Lifecycle Management.
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Investigation into the Use of 3D Scanning and Printing Technologies in the Navy Collaborative Product Lifecycle Management.

机译:三维扫描打印技术在海军协同产品生命周期管理中的应用研究。

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The Navy Collaborative Product Lifecycle Management (CPLM) is notional for the construction of scenarios for this thesis. Theoretically, CPLM works with suppliers to design, manufacture, and distribute parts and equipment required for routine operations. However, there are some issues with this, including the length of time required for designing parts and supply chain interruption, which means that there is a need to improve the process. The option for improvement explored in this research is the use of three-dimensional (3D) scanning (3DS) and printing (3DP) technologies, which respectively offer the ability to generate a computerized shapefile from a 3D object and then to transform this shapefile back into a physical object. 3DS and 3DP technologies are widely used in product design, as it enables rapid production of prototypes, including functional prototypes. 3DP can also be used for rapid manufacturing on a small scale (such as production of spare parts) or large scale (especially using lost-wax casting). These technologies do have a potential benefit for the Navy s CPLM process, because it could help solve problems like supply chain disruption, immediate replacement of parts, and the length of the product development lifecycle. However, 3D technologies can be expensive, and in some cases may not be accurate enough for use. In this research, three distinct scenarios for implementation of 3D technology in the CPLM cycle are examined, including prototyping, small-scale shipboard manufacturing, and large-scale rapid manufacturing. The findings of the research suggest that at the present time the use of 3DS and 3DP technologies is best suited to the design stages of the research, although the rapid manufacturing application also has promise. The shipboard application, although it would resolve a supply chain problem, is too expensive and complicated to be effective at this time.

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