Studies of Intermetallic Growth in Cu-Solder Systems and Wettability at Solid-Liquid Interfaces

摘要

The metallurgical bond formed between tin-lead solder and the copper substrate ischaracterized by the formation of an intermetallic layer. The growth of the intermetallic layer is the result of competing mechanisms, growth of the intermetallic at the intermetallic copper interface and its dissolution at the intermetallic liquid solder interface. These were studied by determining the dissolution rates of the copper and the intermetallic compound. An experimental apparatus for the immersion emersion tensiometric method, which can be used to determine immersion and emersion contact angles and surface tension, was set up and tested. This technique offers several advantages over the conventional sessile drop and tensiometric methods, and can be utilized to study wettability at solid-liquid interfaces.