Double-Sided Wafer Alignment Techniques.

摘要

A project was undertaken by the Harry Diamond Laboratories to develop a double-sided wafer alignment technique by which special-purpose devices could be fabricated using in-house equipment.. The approach developed was inexpensive and did not require infrared alignment methods for viewing through the wafer. A double-sided alignment technique with two different accuracies was developed for use on an ordinary optical mask aligner. These methods were highly successful and are in active use today. Double-sided wafer alignment, double polished wafers, optical mask aligner.