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Structure of the wafer fused InP (001)-GaAs (001) interface

机译:晶圆熔合InP(001)-GaAs(001)界面的结构

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A structural study of wafer fused InP-GaAs interfaces has been carried out. The geometry of the dislocation network which accommodates the twist and the lattice mismatch is first given using a geometrical approach. Cross-sectional transmission electron microscopy and plan view observations are presented. Two different misfit cases are observed. (1) When no twist is present, the 3.7% lattice mismatch is relaxed by a regular square network of dislocations with pure edge character. (2) When an additional twist is present, a square network of dislocations results as well but here the dislocations have a mixed character; 60o dislocations are also observed, some form closed defect circuits and others very likely accommodate a small tilt. The interaction between the 60o dislocations and the edge dislocations is explained in detail. Voids or inclusions are also observed as well as additional dislocations which may accommodate part of the thermal mismatch.
机译:进行了晶圆熔合InP-GaAs界面的结构研究。首先使用几何方法给出适应扭曲和晶格失配的位错网络的几何形状。介绍了横截面透射电子显微镜和平面图观察结果。观察到两种不同的失配情况。 (1)当不存在扭曲时,具有纯边缘特征的位错的规则正方形网络可缓解3.7%的晶格失配。 (2)当出现额外的扭曲时,也会产生位错的方形网络,但此处的位错具有混合特性;还观察到60o的错位,有些形成闭合的缺陷电路,而另一些很可能具有较小的倾斜度。详细解释了60o位错和边缘位错之间的相互作用。还观察到空隙或夹杂物,以及可能容纳部分热失配的其他位错。

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