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Indium oxide co-doped with tin and zinc: A simple route to highly conducting high density targets for TCO thin-film fabrication

机译:锡和锌共掺杂的氧化铟:制备TCO薄膜的高导电高密度靶材的简单方法

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摘要

Indium oxide co-doped with tin and zinc (ITZO) ceramics have been successfully prepared by direct sintering of the powders mixture at 1300 °C This allowed us to easily fabricate large highly dense target suitable for sputtering transparent conducting oxide (TCO) films, without using any cold or hot pressing techniques. Hence, the optimized ITZO ceramic reaches a high relative bulk density (~ 92% of In_2O_3 theoretical density) and higher than the well-known indium oxide doped with tin (ITO) prepared under similar conditions. All X-ray diagrams obtained for ITZO ceramics confirms a bixbyte structure typical for In_2O_3 only. This indicates a higher solubility limit of Sn and Zn when they are co-doped into In_2O_3 forming a solid-solution. A very low value of electrical resistivity is obtained for [In_2O_3:Sn_(0.10)]:Zn_(0.10) (1.7 x 10~(-3) Ω cm, lower than ITO counterpart) which could be fabricated to high dense ceramic target suing pressure-less sintering.
机译:通过在1300°C下直接烧结粉末混合物,已成功制备了共掺杂锡和锌陶瓷的氧化铟(ITZO),这使我们能够轻松制造适用于溅射透明导电氧化物(TCO)膜的大型高密度靶材,而无需使用任何冷压或热压技术。因此,经过优化的ITZO陶瓷达到了较高的相对堆积密度(约为In_2O_3理论密度的92%),并且比在类似条件下制备的众所周知的掺杂锡的氧化铟(ITO)更高。为ITZO陶瓷获得的所有X射线图均证实了仅In_2O_3典型的双字节结构。这表明当Sn和Zn共掺杂到In_2O_3中形成固溶体时,它们的溶解度极限更高。对于[In_2O_3:Sn_(0.10)]:Zn_(0.10)(1.7 x 10〜(-3)Ωcm,低于ITO对应物),获得了非常低的电阻率值,可以用于制造高密度陶瓷靶无压烧结。

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