首页> 外文期刊>Solar Energy Materials and Solar Cells: An International Journal Devoted to Photovoltaic, Photothermal, and Photochemical Solar Energy Conversion >Low-defect metamorphic Si (Ge) epilayers on Si (001) with a buried template of nanocavities for multiple-junction solar cells
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Low-defect metamorphic Si (Ge) epilayers on Si (001) with a buried template of nanocavities for multiple-junction solar cells

机译:具有多结太阳能电池纳米腔的掩埋模板的Si(001)上的低缺陷变质Si(Ge)外延层

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Si (001)-oriented substrates (p-type) were implanted at 10 keV with He ion doses in the 5 x 10(15) cm(-2) range. They were annealed at 973 K for 1 h to create a buried layer of nano-sized bubbles. Layers of Si0.37Ge0.23 about 215 nm thick were grown by low pressure chemical vapor deposition at 848 K on these silicon wafers. The surface roughness and morphology were checked by atomic force microscopy and optical microscopy before and after etching with a modified Shimmel recipe to reveal etch pit dislocations. The thickness, composition, crystalline quality and relaxation-state of the SiGe layer were assessed by Rutherford backscattering spectroscopy and high-resolution X-ray diffraction. A fully relaxed strain-state was obtained for Si0.77Ge0.23 layers that did not exhibit the classical cross-hatched pattern morphology while having a threading-dislocations density below 10(3) cm(-2). This low dislocation density was confirmed by photoluminescence spectroscopy. From high resolution transmission electron microscopy observations, the quasi-total strain-relief is assumed to take place by emission of dislocation loops protruding down into the Si substrate from the SiGe/Si interface and terminating at void surfaces of the buried-nanoporous layer. Possible annihilation of dislocation segments coming from either the SiGe/Si interface or punched out in glide planes by overpressurized nanobubbles may also occur. This near surface porous Si is well adapted for multiple junction solar cell manufacturing. (C) 2014 Elsevier B.V. All rights reserved.
机译:以10 keV注入Si(001)取向的衬底(p型),He离子剂量在5 x 10(15)cm(-2)范围内。将它们在973 K退火1小时,以形成纳米尺寸气泡的掩埋层。通过在这些硅晶片上以848 K的低压化学气相沉积来生长约215 nm厚的Si0.37Ge0.23层。在用改进的Shimmel配方蚀刻之前和之后,通过原子力显微镜和光学显微镜检查表面粗糙度和形态,以揭示蚀刻凹坑位错。通过卢瑟福背散射光谱和高分辨率X射线衍射评估了SiGe层的厚度,组成,晶体质量和弛豫状态。对于Si0.77Ge0.23层,获得了完全松弛的应变状态,该层未显示出经典的剖面线图案形态,而其线错位密度低于10(3)cm(-2)。通过光致发光光谱法证实了这种低位错密度。从高分辨率透射电子显微镜观察,假定准总应力消除是通过位错环的发射而发生的,该位错环从SiGe / Si界面向下伸入Si衬底并终止于埋入的纳米孔层的空隙表面。也可能发生位错片段的or灭,该位错片段要么来自SiGe / Si界面,要么被超压的纳米气泡在滑行面上冲出。这种近表面多孔硅非常适合于多结太阳能电池的制造。 (C)2014 Elsevier B.V.保留所有权利。

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