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Ultrahigh-power picosecond current switching by a silicon sharpener based on successive breakdown of structures

机译:基于结构连续击穿的硅磨刀器进行的超大功率皮秒电流切换

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摘要

Ultrafast current switching by a silicon sharpener based on successive breakdown of structures has been experimentally implemented and theoretically studied. A voltage pulse with an amplitude of 180 kV and a rise time of 400 ps was applied to a semiconductor device containing 44 series-connected diode structures positioned in a 50-Ω transmission line. After device switching, pulses with an amplitude of 150 kV and a rise time of 100 ps were obtained in the transmission line. Numerical simulation showed that the electric field near the p-n junction reaches the Zener breakdown threshold (~10~6 V/cm) at an input voltage rise rate of more than 4 × 10~(13) V/s per structure achieved in the experiment, even when the diode structure contains technological impurities with deep ionization levels and a concentration of 10~(11) cm~(-3).
机译:已经通过实验实现和理论研究了基于结构连续击穿的硅磨刀器进行的超快速电流切换。将幅度为180 kV,上升时间为400 ps的电压脉冲施加到包含44个串联连接的二极管结构的半导体器件中,该二极管结构位于50Ω传输线上。器件切换后,在传输线中获得了幅度为150 kV和上升时间为100 ps的脉冲。数值模拟表明,在该实验中,每个结构的输入电压上升速率大于4×10〜(13)V / s时,pn结附近的电场达到齐纳击穿阈值(〜10〜6 V / cm) ,即使二极管结构包含深电离水平且浓度为10〜(11)cm〜(-3)的技术杂质。

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