Study of thermal behaviour in a multi-chip-composed microinstrumentation system

摘要

A microinstrumentation system based on a multi-chip module (MCM) with an active silicon platform is a promising appr#ach for realizing complex measurement systems in silicon. Fabrication compatibility problems are avoided and dimensional advantages of on-chip smart sensors are almost maintained. However, thermal management is complicated due to redtuction of system dimensions and integration of additional infrastructural functions in the platform. To enable the design of an adaptive temperature-control system for maintaining relability and increasing functional availability, the thermal characteristics of the microinstrumentation system have been analysed theoretically and verified experimentally. The glue bonding layer used for die attachment and the package-to-ambient interface have been identified as the dominant thermal resistors. The measured thermal response time ( < 1 s) and low lateral temperature gradient over the platform (no hot spots) indicate that a single-point thermal management scheme is required and sufficient. # 1998 Elsevier Science S.A. All rights reserved.