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首页> 外文期刊>Optoelectronics, Instrumentation and Data Processing >Dislocations in CdTe Heteroepitaxial Structures on GaAs(301) and Si(301) Substrates
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Dislocations in CdTe Heteroepitaxial Structures on GaAs(301) and Si(301) Substrates

机译:GaAs(301)和Si(301)衬底上CdTe异质外延结构中的位错

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Initial stages of ZnTe growth on GaAs(301) and Si(301) substrates by the method of molecular beam epitaxy are investigated by means of in situ one-wave ellipsometry. Layer-by-layer growth of the ZnTe film is observed on GaAs(301) substrates, whereas 3D nucleation occurs during epitaxy on Si(301) substrates. Misfit dislocations (MDs) are inserted into the ZnTe film during the growth of the first monolayers. Owing to MDs, the film lattice turns with respect to the substrate lattice, which is confirmed by X-ray measurements. Threading segments of MDs in CdTe/ZnTe/GaAs(301) and CdTe/ZnTe/Si(301) heterostructures are subjected to etching. The etch dislocation pits are found to have different shapes, which testifies to different types of threading dislocations. In the case of layer-by-layer etching, the dislocation density is found to increase inward the CdTe film, which testifies to annihilation of dislocations in the course of growth of CdTe films. The dislocation annihilation rate is higher in films grown on GaAs(301) than in those grown on Si(301). A possible reason is the higher mobility of dislocations in CdTe films on GaAs(301) substrates.
机译:ZnTe在GaAs(301)和Si(301)衬底上通过分子束外延生长的初始阶段通过原位单波椭圆仪研究。在GaAs(301)衬底上观察到了ZnTe膜的逐层生长,而在Si(301)衬底上进行外延期间发生了3D成核。在第一单层生长期间,将错配位错(MDs)插入ZnTe膜中。由于MD,薄膜晶格相对于衬底晶格转动,这通过X射线测量得到证实。对CdTe / ZnTe / GaAs(301)和CdTe / ZnTe / Si(301)异质结构中MD的螺纹段进行蚀刻。发现蚀刻位错坑具有不同的形状,这证明了不同类型的螺纹位错。在逐层蚀刻的情况下,发现位错密度向内增加CdTe膜,这证明了CdTe膜生长过程中的位错消失。在GaAs(301)上生长的薄膜的位错an灭率高于在Si(301)上生长的薄膜。一个可能的原因是GaAs(301)衬底上CdTe薄膜中位错的迁移率更高。

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