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Effects of Cu addition on band gap energy, density of state effective mass and charge transport properties in Bi2Te3 composites

机译:铜的添加对Bi2Te3复合材料中带隙能,态有效质量密度和电荷输运性能的影响

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摘要

We report the effects of Cu addition on the charge transport properties in n-type CuxBi2Te3 composites. The conducting behavior of the composites changed from metallic to semiconducting character with the increase in the amount of Cu, and its origin was found to be the decrease in the electron concentration by the substitution of Bi with Cu. Hall mobilities in the Cu-substituted composites were significantly enhanced due to the alleviated ionized impurity scattering, however, they were governed dominantly by electron-acoustic phonon scattering at relatively high temperature. As well as the carrier concentration and mobility, the electronic structure of Bi2Te3 was also affected by the Cu addition, and it was manifested by both the increase in the band gap (similar to 198 meV in Cu0.04Bi2Te3) and the reduction in the density of state effective mass in the Cu-substituted Bi2Te3 composites.
机译:我们报告了铜的添加对n型CuxBi2Te3复合材料中电荷传输性能的影响。随着Cu含量的增加,复合材料的导电行为从金属特性转变为半导体特性,并且发现其起源是由于Bi被Cu取代而导致电子浓度下降。铜取代的复合材料中的霍尔迁移率由于离子化杂质的散射得到缓解而显着增强,但是,它们在较高温度下主要受电子声子声子散射的控制。除了载流子浓度和迁移率以外,Bi2Te3的电子结构也受Cu添加的影响,其表现为带隙的增加(类似于Cu0.04Bi2Te3中的198 meV)和密度的降低。在铜取代的Bi2Te3复合材料中的状态有效质量。

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