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Direct determination of track etch rate and response of CR-39 to normal incidence high-energy heavy ions

机译:直接确定轨迹蚀刻速率和CR-39对垂直入射高能重离子的响应

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摘要

Response of CR-39 to high-energy heavy ions was investigated by using optical microphotographs of track profiles for Ar (480 MeV) and Ni (300 MeV). The depth dependence of track etch rate (V-r) was determined experimentally by track length measurement. The results indicate that V-r for the low REL Ar tracks is depth independent but for the high REL Ni tracks V-r is gradually decreasing with depth. The region beyond 30 mum depth inside the detector shows a stable region regarding the detector response for both ions. (C) 2001 Published by Elsevier Science Ltd. [References: 7]
机译:通过使用Ar(480 MeV / n)和Ni(300 MeV / n)轨迹曲线的光学显微照片研究了CR-39对高能重离子的响应。轨道蚀刻速率(V-r)的深度依赖性通过轨道长度测量通过实验确定。结果表明,低REL Ar轨道的V-r与深度无关,而高REL Ni轨道的V-r随着深度逐渐减小。检测器内部深度超过30毫米的区域显示出一个稳定的区域,与两种离子的检测器响应有关。 (C)2001年由Elsevier Science Ltd.出版[参考文献:7]

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