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Effect of Image Force on Tunneling Current for Ultra Thin Oxide Layer Based Metal Oxide Semiconductor Devices

机译:成像力对基于超薄氧化物层的金属氧化物半导体器件隧穿电流的影响

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摘要

In this letter, an analytical model for evaluation of tunneling current density of ultra thin Metal Oxide Semiconductor (MOS) devices is presented. For such devices, the area of the potential barrier is reduced by rounding off the corners, reducing the thickness due to image potential, hence are very important for accurate modeling. In this work, improvement in the analysis is brought in by taking into account the barrier height lowering due to the image force effect. The voltage range under consideration is 0 <= V <= psi(1)/e. Tunnel resistivity is also evaluated utilizing this tunneling current density model. Theoretical predictions are compared with the results obtained by the 2D numerical device simulator ATLAS and published experimental results, excellent agreements between the three are observed.
机译:在这封信中,提出了一种用于评估超薄金属氧化物半导体(MOS)器件的隧穿电流密度的分析模型。对于此类设备,通过修圆角来减小势垒的面积,由于图像电势而减小厚度,因此对于精确建模非常重要。在这项工作中,通过考虑由于像力效应而导致的栅栏高度降低,提高了分析质量。所考虑的电压范围为0 <= V <= psi(1)/ e。利用该隧道电流密度模型还可以评估隧道电阻率。将理论预测与2D数值设备模拟器ATLAS获得的结果进行比较,并发表实验结果,观察到两者之间的一致性极好。

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