Wire Sweep Characterization in System-in-Package (SiP) Component with Au Wire Bonding During Epoxy Molding Compounds Molding Process

摘要

We focused failure analysis of a System-in-Package (SiP) component including wire sweep and epoxy molding compounds (EMC) molding flow during the molding process. The SiP component was assembled by flip-chip and wire bonding with 0.7 mil diameter on a substrate with EMC. Two Si devices were used, one of which was bonded using ball grid array (BGA) solder balls, and underfill process was then performed to fill the gap between the Si device and the substrate after joining. The other Si device was wire-bonded on the substrate using Au wire. However, wire sweep and wire lift happened during EMC molding process. To reduce the wire sweep and wire lift, we changed the bonding structure of stitch-bonded Au wire to the double bonding. As a result, wire lift did not occur and the wire sweep reduced.