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Structural and electrical characterization of ultrathin Er_2O_3 films grown on Si(001) by reactive evaporation

机译:反应蒸发在Si(001)上生长的Er_2O_3超薄膜的结构和电学表征

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摘要

Stoichiometric, amorphous, uniform Er_2O_3 films are deposited on Si(001) substrates by reactive evaporation using a metallic Er source at room temperature in an oxygen ambient pressure of 9 x 10~(-6) Torr. Transmission electron microscopic measurement shows that the film possesses good thermal stability and forms a sharp interface with its Si substrate after annealing at 700 deg C for 30 min in ultrahigh vacuum. The effective dielectric constant (k) of the film is measured to be 12.6, and its effective oxide thickness (EOT) can reach 1.4 nm, with a low leakage current density of 8 x 10~(-4) A cm~(-2) at an electric field of 1 MV cm~(-1) after annealing. The characteristics obtained indicate that ultrathin amorphous Er_2O_3 film could be a promising candidate for a high-k gate dielectric in Si microelectronic devices.
机译:在室温下,氧环境压力为9 x 10〜(-6)Torr下,通过使用金属Er源进行反应蒸发,将化学计量的,无定形的,均匀的Er_2O_3薄膜沉积在Si(001)衬底上。透射电子显微镜测量表明,该膜具有良好的热稳定性,并且在超高真空下于700℃退火30分钟后,与Si衬底形成清晰的界面。测得该膜的有效介电常数(k)为12.6,其有效氧化物厚度(EOT)可以达到1.4 nm,漏电流密度低至8 x 10〜(-4)A cm〜(-2退火后在1 MV cm〜(-1)的电场下)。获得的特性表明,超薄非晶Er_2O_3薄膜可能是Si微电子器件中高k栅极电介质的有希望的候选者。

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