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Self-organized nanodot pattern fabrication using the reverse sputtering method

机译:使用反向溅射法自组织纳米点图形

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摘要

We demonstrate the synthesis of high density periodic 2D nanodot patterns using reverse sputtering in magnetron sputtering equipment on a single crystal Si substrate and sputter-deposited Si-thin film. In this etching process, a minute amount of Ta is supplied by DC sputtering or splashing from the substrate holder surface. STEM, EDX, TEM and XPS analyses confirmed preferentially localized Ta-silicide in the nanodots. The nanodot pattern formation is attributed to the repeated adsorption and desorption of Ta and Si molecules forming Ta-silicide, and its segregation with self-organization. We also discuss power and time dependence of the nanodot pattern sizes and hole structure formation as a side-effect. This simple process is conducted at room temperature and makes use of an extremely simple setup. Our result promises a significant improvement in the productivity of quantum dot devices and has the potential to trigger their worldwide spread.
机译:我们展示了在单晶硅衬底和溅射沉积的硅薄膜上使用磁控溅射设备中的反向溅射技术合成高密度周期性2D纳米点图形的方法。在该蚀刻工艺中,通过DC溅射或溅射从基板保持器表面供应微量的Ta。 STEM,EDX,TEM和XPS分析证实了纳米点中优先定位的Ta硅化物。纳米点图案的形成归因于Ta和Si分子的重复吸附和解吸,形成Ta硅化物,以及其自组织离析。我们还讨论了纳米点图案尺寸与孔结构形成的功率和时间相关性,作为副作用。这个简单的过程是在室温下进行的,并且使用了非常简单的设置。我们的结果有望大大提高量子点设备的生产率,并有可能触发其在全球范围内的普及。

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