ITO Wet Etch Properties by Various Moving Modes of Substrate in an In-Line Wet Etch/Cleaning System

摘要

For the cost reduction in the fabrication of display panels, a reverse moving system was equipped to a new compacted in-line wet etch/cleaning system. For the possibility of the alternating movement of glass substrate during wet etch process, indium tin oxide (ITO) patterns were obtained by wet etch process in various moving modes of glass substrates in the new system and the results were compared and analyzed. The results showed that the alternating motion of substrate is superior to the normal motion of substrate in etch rate and is almost equivalent to the normal motion in etch uniformity.