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A robust and low-power 2-D thermal wind sensor based on a glass-in-silicon reflow process

机译:基于硅玻璃回流工艺的强大,低功耗二维热风传感器

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摘要

In this paper, the design, fabrication, and characterization of a robust and low-power micro-machined two-dimensional (2-D) wind sensor based on a glass-in-silicon reflow process are presented for the first time. The four thermistors, which act simultaneously as heat sources and as temperature sensors, are placed on a low thermal conductivity glass substrate, and arranged in a Wheatstone bridge configuration supplied with constant voltage. In this self-heated mode, the total power consumption of the sensor could be reduced into the sub-milliwatt range, offering high initial sensitivity and wide measurement range, respectively. The embedded vertical silicon vias in the glass substrate are used to realize the electrical connections between the sensing elements and the electrode-pads, which are respectively placed on the front and the back surface of the chip. Then, the sensor and the external circuit are connected using the wire-bonding process through the electrode-pads on the back surface. The bonding wires at the backside is encapsulated by polyester paint, protecting the electrical connections of the sensor from the effect of the external environment. In addition, a passivation layer of nitride is deposited on the surface of the wind sensor to prevent direct exposure of the sensing elements to harsh media. The sensor was tested in a wind tunnel in constant voltage mode. Measurement results show that the thermal wind sensor can measure wind speeds up to 17.5 m/s, and the measured sensitivities of the sensor with different applied voltages (0.5, 1, 1.5 V) are, respectively 24.9, 148.3 and 440.61 mV/(m/s) at zero-flow point. The corresponding power consumption of the sensor with different voltages are respectively 4.81, 19.23 and 43.27 mW. Measurement results also show that wind direction in a full range of 360A degrees with an err within 6A degrees could be obtained. The proposed sensor can be used for many applications with a low power consumption and high reliability.
机译:本文首次提出了基于硅玻璃回流工艺的鲁棒且低功耗的微加工二维(2-D)风传感器的设计,制造和表征。四个热敏电阻同时用作热源和温度传感器,它们被放置在低导热率的玻璃基板上,并以惠斯通电桥结构进行配置,并提供恒定电压。在这种自加热模式下,传感器的总功耗可以降低到亚毫瓦范围内,分别提供较高的初始灵敏度和较宽的测量范围。玻璃基板中嵌入的垂直硅通孔用于实现传感元件和电极焊盘之间的电连接,它们分别位于芯片的正面和背面。然后,通过打线工艺通过背面上的电极垫连接传感器和外部电路。背面的接合线被聚酯漆包封,从而保护传感器的电连接不受外部环境的影响。另外,氮化物的钝化层沉积在风传感器的表面上,以防止传感元件直接暴露于苛刻的介质。该传感器在风洞中以恒定电压模式进行了测试。测量结果表明,热风传感器可以测量高达17.5 m / s的风速,并且在不同施加电压(0.5、1、1.5 V)的情况下,传感器的灵敏度分别为24.9、148.3和440.61 mV /(m / s)在零流量点。具有不同电压的传感器的相应功耗分别为4.81、19.23和43.27 mW。测量结果还表明,可以获得360A度整个范围内的风向,误差在6A度以内。所提出的传感器可以以低功耗和高可靠性用于许多应用。

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