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首页> 外文期刊>Metals and Materials >Synthesis of Cubic Boron Nitride Thin Films by Low-Energy Ion Beam Assisted Deposition by Applying Substrate Bias
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Synthesis of Cubic Boron Nitride Thin Films by Low-Energy Ion Beam Assisted Deposition by Applying Substrate Bias

机译:应用衬底偏压低能离子束辅助沉积合成立方氮化硼薄膜

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摘要

Cubic boron nitride (c-BN) films are synthesizedwith low-energy ions of 100eV from a gridless ion gun byapplying negative substrate bias. Boron is evaporated by anelectron beam at rates of 0.8 to 2.3A/sec onto silicon substrate.Substrate temperature and bias are varied from 400 to 800℃ andfrom 0 to -700Y respectively. Due to the low-operating pressureof the ion beam assisted deposition (IBAD) process, applyingsubstrate bias efficiently accelerates ions enough for synthesis ofthe c-BN phase. With increasing substrate bias, the major phasechanges in the sequence of hexagonal boron nitride (h-BN) to c-BN to h-BN. The reappearance of the hexagonal phase at high biasvoltage is thought to be due to the stress annealing effect.Intermediate temperatures have produced higher c-BN contents.Far-off stoichiometric film (NIB=0.72) consists of h-BN phaseeven under the c-BN parameter but a little off stoichiometry hasled to higher c-BN contents. The maximum contents of c-BNphase is about 70%. DC type bias and oxygen/hydrogenincorporation into the films are presumed to limit the content. TheIBAD process with proper substrate bias is promising for largeareas of and high rate growth of the c-BN phase.
机译:通过施加负衬底偏压,从无栅极离子枪中合成具有100eV的低能离子的立方氮化硼(c-BN)薄膜。硼通过电子束以0.8至2.3A / sec的速度蒸发到硅衬底上。衬底温度和偏压分别在400至800℃和0至-700Y之间变化。由于离子束辅助沉积(IBAD)工艺的工作压力低,施加衬底偏压可有效地加速离子,足以合成c-BN相。随着衬底偏压的增加,六方氮化硼(h-BN)到c-BN到h-BN的顺序发生主要相变。六方相在高偏置电压下的重现被认为是由于应力退火效应引起的。中间温度产生了更高的c-BN含量。远距离化学计量膜(NIB = 0.72)即使在c-下也由h-BN相组成。 BN参数,但化学计量比偏低,导致更高的c-BN含量。 c-BNphase的最大含量约为70%。推测DC型偏压和氧/氢掺入膜中会限制含量。具有适当的衬底偏压的IBAD工艺有望用于c-BN相的大面积和高速率生长。

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