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A low-temperature preparation of ferroelectric Sr_xBi_(2+y)Ta_2O_9 thin film and its application to metal-ferroelectric-insulator-semiconductor structure

机译:铁电Sr_xBi_(2 + y)Ta_2O_9薄膜的低温制备及其在金属-铁电绝缘体-半导体结构中的应用

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摘要

Preferentially (105)-oriented Sr_(0.7)B_(2.8)Ta_2O_9 (SBTO) thin films on SiO_2-Hi (100) have been prepared by pulsed laser deposition at temperatures as low as 350 beg C, which is the lowest process temperature for growing SBTO ferroelectric thin films. Dielectric properties of the SBTO films have been improved by increasing the Sr/B atomic ratio from 0.7/2.8 to 0.7/2.0. Memory windows of as large as 3.6 and 4.3 V in the MFIS capacitor have been obtained at Sr/B ratios of 0.7-2.0 and 1.0/2.0 respectively and are the largest values reported in the MF(I)S diode structures. Little C-V degradation is observed up to with the 10~(10) cycles for the process temperature of 400 deg C, especially for Sr/B of 0.7/2.0, with the memory window remaining at more than 3.2 V. Memory retention time was about 3 X 10~3 s at which the difference in capacitance between 'ON' and 'OFF' states reduces to half of its initial value. Optimum hold bias voltage exists in the retention test. Improvement in memory characteristics is strongly related to the insulating properties of the ferroelectric and dielectric thin films rather than the value of dielectric constant.
机译:SiO_2 / n-Hi(100)上的(105)取向Sr_(0.7)B_(2.8)Ta_2O_9(SBTO)薄膜已通过脉冲激光沉积在低至350 beg C的温度下制备,这是最低的工艺SBTO铁电薄膜生长的温度。通过将Sr / B原子比从0.7 / 2.8增加到0.7 / 2.0,可以改善SBTO薄膜的介电性能。分别以0.7-2.0和1.0 / 2.0的Sr / B比获得了MFIS电容器中高达3.6和4.3 V的存储窗口,这是MF(I)S二极管结构中报道的最大值。在400℃的过程温度下,直至10〜(10)个循环,几乎没有CV下降,特别是对于Sr / B为0.7 / 2.0的情况,内存窗口保持在3.2 V以上。内存保留时间约为3 X 10〜3 s,“ ON”和“ OFF”状态之间的电容差减小到其初始值的一半。保持测试中存在最佳的保持偏置电压。存储特性的提高与铁电薄膜和电介质薄膜的绝缘性能密切相关,而不是与介电常数的值相关。

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