An isotropic Damage Mechanism during Grinding of CdZnTe Wafers

摘要

The grinding wheels with grit size of #600 and #2000 are employed to grind CdZnTe (110) and (111) planes, and ground surface and subsurface damages were investigated. The experimental results show the damage types are affected by the crystallographic orientation and grit size. When grinding CdZnTe wafers with grit size of #600, due to different angle between the cleavage plane and ground surface, the surface morphology and directions of cracks on the (111) plane are different from those on the (110) plane. When grinding CdZnTe wafers with grit size of #2000, the (111) plane has less plastic deformation than the (110) plane, and there is obvious direction of stacking faults on subsurface.