Cleaning implications of lead-free assembly and packaging - part 2

摘要

Critical process aspects of emerging lead-free pastes create many challenges for assembly operations. Not the least of which is a new or expanded requirement for flux removal cleaning of routine production product. Additionally, the absence of lead is not the only material change in these new lead-free products. Solder paste developers have aggressively advanced their craft since the days of CFC-113 and RMA. These new materials often dramatically change the requirements of defluxing materials used in the cleaning process, This article will detail these new developments. The article will review the evolution of cleaning technology, starting with the CFC-113 days (when many have last considered cleaning) and continuing to the present. This will include a detailed technical analysis of the three cleaning genres: vapor phase, semi aqueous and aqueous.