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Cleanliness Assessment for Class Ⅲ Lead-Free No-Clean Assemblies

机译:Ⅲ级无铅免清洗组件的清洁度评估

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摘要

When building Class Ⅲ products, it is essential to thoroughly understand the cleaning process and be assured that it has been optimized based on board design, cleaning equipment type, cleaning agent selected, operating parameters used, paste and flux types used and residues generated. The OEM for which this DoE was developed understood the importance of the cleaning process and sought empirical data to design and verify the cleaning process.
机译:制造Ⅲ类产品时,必须全面了解清洁过程,并确保已根据电路板设计,清洁设备类型,所选清洁剂,使用的操作参数,使用的焊膏和助焊剂类型以及产生的残留物对其进行了优化。开发此DoE的OEM了解清洁过程的重要性,并寻求经验数据来设计和验证清洁过程。

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