CLEANING AGENT COMPOSITION FOR LEAD-FREE SOLDER FLUX, AND METHOD FOR CLEANING LEAD-FREE SOLDER FLUX

摘要

To provide a cleaning agent composition for lead-free solder flux that can clean a flux residue generated when soldering rosin flux or water-soluble flux in a short period of time, and furthermore that has an excellent gap cleaning property even when cleaning a substrate having a very narrow gap.SOLUTION: Provided is a cleaning agent composition for lead-free solder flux containing (A) polyoxyalkylene monoalkyl ether having a HLB of 11 or more, (B) dialkylene glycol dialkyl ether, and (C) hydroxycarboxylic acid.SELECTED DRAWING: None