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IRC's Anotherm Technology Provides Superior Thermal Conductivity to Polymer-Based Insulated Metal Substrates

机译:IRC的Anotherm技术为基于聚合物的绝缘金属基板提供卓越的导热性

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摘要

TT electronics IRC Advanced Film Division has developed a new substrate technology that offers numerous benefits over conventional polymer-based insulated metal substrates (IMS). Designated Anotherm, IRC's new material-consists of a thermally conductive aluminum alloy substrate insulated by a thin, chemically grown, anodized dielectric layer, with solderable screen-printed conductors applied to the anodized layer. Traditional insulated metal substrate technology (IMS) often relies on a polymer or epoxy material that is mechanically applied to a bare aluminum substrate, which requires extensive surface preparation, as well as a minimum thickness of approximately 75 microns. In addition, traditional IMS technology is subject to delamination at high temperatures.
机译:TT电子公司IRC高级电影事业部开发了一种新的基板技术,该技术比传统的基于聚合物的绝缘金属基板(IMS)具有许多优势。 IRC的新材料被指定为Anotherm,该材料由导热铝合金基板组成,该基板由薄薄的化学生长阳极氧化电介质层绝缘,并在阳极氧化层上施加了可焊接的丝网印刷导体。传统的绝缘金属基板技术(IMS)通常依赖于聚合物或环氧树脂材料,该材料或机械材料机械地应用于裸露的铝基板,这需要大量的表面准备工作,并且最小厚度约为75微米。另外,传统的IMS技术在高温下会分层。

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