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Implementation of a thermodynamic framework for damage mechanics of solder interconnects in microelectronics packaging

机译:用于微电子封装中焊料互连的损伤力学的热力学框架的实现

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摘要

A thermodynamic framework for damage mechanics is proposed. The damage evolution function uses entropy as a damage metric. A damage-coupled viscoplastic model with kinematic and isotropic hardening is implemented in a commercial finite element code to simulate the thermo-mechanical behavior of eutectic solder interconnects in microelectronics packaging. The damage, as an internal state variable, is coupled with a unified viscoplastic constitutive model to characterize the cyclic deterioration of the material under thermo-mechanic fatigue loads. Several computational simulations of uniaxial monotonic tensile and cyclic shear tests are conducted to validate the model with experimental results. The behavior of a Ball Grid Array (BGA) package under thermo-mechanic fatigue loading is also simulated and compared with experimental results.
机译:提出了损伤力学的热力学框架。损伤演化函数使用熵作为损伤度量。在商业有限元代码中实现了具有运动学和各向同性硬化的损伤耦合粘塑性模型,以模拟微电子封装中共晶焊料互连的热机械行为。作为内部状态变量的损伤与统一的粘塑性本构模型相结合,以表征材料在热机械疲劳载荷下的周期性劣化。进行了单轴单调拉伸和循环剪切试验的几种计算模拟,以用实验结果验证该模型。还对球栅阵列(BGA)封装在热机械疲劳载荷下的行为进行了仿真,并与实验结果进行了比较。

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