High-density PCBs populated with advanced packages are inspected for assembly faults by AOI and X-ray systems before entering electrical test

Howard W.Markstein

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High-density PCBs populated with advanced packages are inspected for assembly faults by AOI and X-ray systems before entering electrical test

机译：进入电气测试之前，AOI和X射线系统会检查装有高级封装的高密度PCB的组装故障。

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《Electronic Packaging and Production》 |1998年第15期|共1页
作者
Howard W.Markstein;
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入库时间 2022-08-18 10:48:19

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1. High-density PCBs populated with advanced packages are inspected for assembly faults by AOI and X-ray systems before entering electrical test [J] . Howard W.Markstein Electronic Packaging and Production . 1998,第15期

机译：进入电气测试之前，AOI和X射线系统会检查装有高级封装的高密度PCB的组装故障。
2. Flexible x-ray system inspects tall, rigid containers for faults [J] . Gail Hunt Machinery Update . 2015,第1期

机译：灵活的X射线系统可检查高大的刚性容器是否有故障
3. Advanced Signal Processing Tools for the Vibratory Surveillance of Assembly Faults in Diesel Engine Cold Tests [J] . Simone Delvecchio, Gianluca DElia, Emiliano Mucchi, Journal of Vibration and Acoustics . 2010,第2期

机译：先进的信号处理工具，用于柴油机冷测试中的装配故障的振动监测
4. Challenges in High-Density PCB Assembly: New Strategies for Improving Quality INspection and Test [C] . Ana I.De Marco SMTA(Surface Mount Technology Association) International San Jose, California September 12-16, 1999 . 1999

机译：高密度PCB组装中的挑战：改善质量检查和测试的新策略
5. Advanced adhesion strength testing methods of thin film multilayers in electronic packaging systems. [D] . Mahan, Kenneth Howard. 2016

机译：电子包装系统中多层薄膜的先进粘合强度测试方法。
6. Trend of Inspection Technologies for Inspecting 3-Dimensional Shapes and for Inspecting Internal Structures by X-ray for Electronic Packages, and Activities of Sensory Evaluation Systematization Working Group [O] . 2017

机译：检查技术检查技术的趋势，并通过X射线检查内部结构进行电子封装，以及感官评估系统化工作组的活动

High-density PCBs populated with advanced packages are inspected for assembly faults by AOI and X-ray systems before entering electrical test

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