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Effect of Structural Change on Thermoelectric Properties of the Chalcogenide Ge_2Sb_2Te_5 Thin Films

机译:结构变化对硫族化物Ge_2Sb_2Te_5薄膜热电性能的影响

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摘要

Ge_2Sb_2Te_5 (GST) films grown onto SiO_2 (250 nm)/Si substrate at room temperature were annealed at various temperatures to investigate the structural variations. The GST films changed from amorphous to face-centered cubic (FCC) and hexagonal closed packed (HCP) crystalline phases as the annealing temperature increases and the samples annealed at 380°C showed co-existence of the FCC and the HCP. Samples annealed at 380°C showed the highest charge carrier concentration, the lowest resistivity, and the highest power factor.
机译:在不同温度下对室温生长在SiO_2(250 nm)/ Si衬底上的Ge_2Sb_2Te_5(GST)薄膜进行退火,以研究其结构变化。随着退火温度的升高和在380°C退火的样品的存在,GST薄膜从无定形变为面心立方(FCC)和六方密堆积(HCP)晶相,表明FCC和HCP共存。在380°C退火的样品显示出最高的载流子浓度,最低的电阻率和最高的功率因数。

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