Correlation between Magnetron Discharge and Characteristics of Alloy (Ti,Cu)N Nano-Structure Thin Films

Rahmati A.

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Correlation between Magnetron Discharge and Characteristics of Alloy (Ti,Cu)N Nano-Structure Thin Films

机译：磁控管放电与合金（Ti，Cu）N纳米结构薄膜特性的相关性

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Reactive magnetron sputtering using an alloy TiCu target and nitrogen as working gas was utilized to deposit ternary (Ti,Cu)N thin films. The aim of present work is to provide insight into the significance of nitrogen pressure, Ti addition, reflected neutral particles and energy flux on the characteristic of (Ti,Cu)N films.

机译：利用合金TiCu靶材和氮气作为工作气体的反应磁控溅射技术沉积了三元（Ti，Cu）N薄膜。本工作的目的是提供有关（Ti，Cu）N薄膜特性的氮气压力，Ti添加量，反射的中性粒子和能量通量的重要性的见解。

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《ECS Journal of Solid State Science and Technology》 |2016年第3期|共7页
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Rahmati A.;
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正文语种 eng
中图分类电化学工业;
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1. Correlation between Magnetron Discharge and Characteristics of Alloy (Ti,Cu)N Nano-Structure Thin Films [J] . Rahmati A. ECS Journal of Solid State Science and Technology . 2016,第3期

机译：磁控管放电与合金（Ti，Cu）N纳米结构薄膜特性的相关性
2. Fabrication of highly electrically conductive Ti/Ag/Ti tri-layer and Ti-Ag alloy thin films on PET fabrics by multi-target magnetron sputtering [J] . Liu Chuanmei, Xu Jiangtao, Liu Zhengqin, Journal of materials science . 2018,第22期

机译：多靶磁控溅射在PET织物上制备高导电Ti / Ag / Ti三层和Ti-Ag合金薄膜
3. Structural and electrical properties of (Zr,Ti)(0.85)(Ca,Sr)(0.15)O-1.85 thin films grown on Cu/Ti/SiO2/Si substrate using RF magnetron sputtering [J] . Im Mir, Lee Tae-Ho, Kweon Sang-Hyo, Journal of Ceramic Processing Research. (Text in English) . 2016,第7期

机译：利用射频磁控溅射在Cu / Ti / SiO2 / Si衬底上生长的（Zr，Ti）（0.85）（Ca，Sr）（0.15）O-1.85薄膜的结构和电学性质
4. Shape Memory Behavior of Ti-Ni-X (X= Pd, Cu) Ternary Alloy Thin Films Prepared by Triple-Source DC Magnetron Sputtering [C] . S. lnoue, K. Hori, N. Sawada, International conference on processing manufacturing of advanced materials;THERMEC 2009 . 2010

机译：三源直流磁控溅射制备Ti-Ni-X（X = Pd，Cu）三元合金薄膜的形状记忆行为
5. Modeling of the Stress-Strain-Resistance Behaviour of Ni-Ti and Ni-Ti-Cu Shape Memory Alloys for use in Sensorless Actuator Position Control. [D] . Lynch, Brian. 2013

机译：用于无传感器执行器位置控制的Ni-Ti和Ni-Ti-Cu形状记忆合金的应力-应变-电阻行为建模。
6. Structural Compositional and Plasmonic Characteristics of Ti–Zr Ternary Nitride Thin Films Tuned by the Nitrogen Flow Ratio in Magnetron Sputtering [O] . Lianlian Chen, Yujing Ran, Zhaotan Jiang, 2020

机译：通过磁控溅射中氮流量的氮气流量调节的Ti-Zr三元氮化物薄膜的结构组成和等离子体特性
7. TEXTURE AND RESISTIVITY OF DILUTE BINARY Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir) and Cu(W) ALLOY THIN FILMS [O] . A. Gungor, K. Barmak, A. D. Rollett, 2013

机译：稀土二元Cu（al），Cu（In），Cu（Ti），Cu（Nb），Cu（Ir）和Cu（W）合金薄膜的织构和电阻率

Correlation between Magnetron Discharge and Characteristics of Alloy (Ti,Cu)N Nano-Structure Thin Films

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