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首页> 外文期刊>International Journal of Quantum Chemistry >IMPROVEMENT OF THE THALLIUM CUPRATE THIN FILMS DUE TO AN OPTIMIZATION OF THE DOPING HOLES DENSITIES AS SEEN BY XAS
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IMPROVEMENT OF THE THALLIUM CUPRATE THIN FILMS DUE TO AN OPTIMIZATION OF THE DOPING HOLES DENSITIES AS SEEN BY XAS

机译:由于XAS优化了掺杂孔的密度,因此提高了铜C薄膜的膜厚

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摘要

T-c optimization of as-synthesized Tl 2212 thin films can be obtained through post-annealing treatments at low temperatures (180 and 220 degrees C). In this paper, the optimization process was controlled by ac magnetic susceptibility measurements for the T-c's and by polarized X-ray absorption spectroscopy measurements for the doping hole densities. The latter technique allows a direct insight into the hole density only in the (a, b) plane of the Tl 2212 structure. All the studied thin films are overdoped with respect to the optimum of 0.12 doping holes per copper defined previously. T-c increases up to 6 K were observed after post-annealing treatments under an argon atmosphere and were correlated with significant reduction of the doping hole density. In contrast to what has been observed on sintered samples, a post-annealing treatment at 220 degrees C resulted in an insufficient doping hole density, below the optimum, probably resulting from the small sample thickness. (C) 1996 Academic Press, Inc. [References: 13]
机译:合成后的Tl 2212薄膜的T-c优化可通过在低温(180和220摄氏度)下进行后退火处理来获得。在本文中,通过对T-c进行交流磁化率测量以及对掺杂孔密度进行极化X射线吸收光谱法测量来控制优化过程。后一种技术仅在Tl 2212结构的(a,b)平面中允许直接洞察空穴密度。相对于先前定义的每个铜0.12个掺杂孔的最佳值,所有研究的薄膜都被过量掺杂。在氩气气氛下进行后退火处理后,观察到T-c升高至6 K,并且与掺杂孔密度的显着降低相关。与在烧结样品上观察到的相反,在220摄氏度下进行的退火后处理导致掺杂孔密度不足,低于最佳值,这可能是由于样品厚度小所致。 (C)1996 Academic Press,Inc. [参考:13]

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