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Growth and properties of the dilute bismide semiconductor GaAs{sub}(1-x)Bi{sub}x a complementary alloy to the dilute nitrides

机译:稀铋化物半导体GaAs {sub}(1-x)Bi {sub} x的生长和特性与稀氮化物的互补合金

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In this review we describe the growth and properties of the dilute bismide semiconductor alloy GaAs{sub}(1-x)Bi{sub}x and show how its properties are in certain respects complementary to the dilute nitride alloy, GaN{sub}yAs{sub}(1-y). Like the dilute nitrides the dilute bismides show a giant band gap bowing effect in which a small concentration of the alloying element has a disproportionate effect 6n the band gap, however in the case of the bismide the band gap reduction is associated with an increase in the energy of the valence band maximum (VBM) rather than a reduction in the energy of the conduction band minimum (CBM). Under standard GaAs growth conditions Bi acts as a surfactant with associated improvements in surface quality. In order to incorporate Bi, growth temperatures below 400℃ are used with As{sub}2/Ga flux ratios close to unity. The electron mobility of GaAs is only weakly affected by Bi alloying, in contrast to the dilute nitrides where the electron mobility decreases rapidly with N alloying. Bi alloying also produces a giant bowing effect in the spin orbit splitting in the valence band. Strong room temperature photoluminescenee is observed. Prospects for future device applications of this new compound semiconductor alloy are discussed.
机译:在这篇综述中,我们描述了稀铋化物半导体合金GaAs {sub}(1-x)Bi {sub} x的生长和性能,并显示了其性能在某些方面与稀氮化物合金GaN {sub} yAs互补。 {sub}(1-y)。像稀氮化物一样,稀铋化物也表现出巨大的带隙弯曲效应,其中少量的合金元素对带隙的影响不均衡,但是在铋化物的情况下,带隙的减少会导致带隙的减小。价带最大能量(VBM),而不是导带最小能量(CBM)减小。在标准的GaAs生长条件下,Bi用作表面活性剂,并伴随着表面质量的改善。为了掺入Bi,使用低于400℃的生长温度,As {sub} 2 / Ga的通量比接近于1。与稀氮化物相比,GaAs的电子迁移率几乎不受Bi合金的影响,稀氮化物的电子迁移率随N合金化而迅速降低。双合金化还在价带的自旋轨道分裂中产生巨大的弯曲效应。观察到强的室温光致发光。讨论了这种新型化合物半导体合金在未来器件中的应用前景。

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