Numerical analysis of the cutting interaction between indenters acting on disordered materials

摘要

In this paper, an attempt is made to find some general relations for the microcutting process in brittle or quasi-brittle materials, under different hypotheses of microscopic failure behavior. Fracture beneath the indenters and sudden chip formation are the main dissipation mechanisms taken into consideration. Fracture patterns in more homogeneous brittle solids are obtained by the Finite Element Method in the framework of Linear Elastic Fracture Mechanics (LEFM). On the other hand, the quasi-brittle response due to microstructural heterogeneities is taken into account by Lattice Model simulations. The analysis is not limited to the more common study of a single indenter. When two indenters are acting in parallel, their mutual distance plays an important role. If the indenters are very close, they behave like a unique larger indenter, whereas if the distance is relatively large, their mechanical interaction vanishes. In addition, when the distance is approximately three to four times their dimension, the mechanism of chipping (with formation of secondary chip between the two parallel grooves) can take place, improving the ratio of removed volume to spent energy and then the demolition ability of the two indenters. Some comparisons are proposed between the presented approach and more sophisticated and computationally demanding models from the literature, as well as with experimental data. The analysis should provide useful hints for the optimal design of super-abrasive tools.