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Fabrication of Ferroelectric Gate Memory Device Using BLT/HfO_2/Si Gate Structure

机译:使用BLT / HfO_2 / Si栅极结构制造铁电栅极存储器件

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摘要

Ferroelectric gate FET's with BLT/HfO_2 structure were fabricated on 5-inch-scale Si wafer using well-refined CMOS compatible 0.8 (mu)m-based fabrication processes for the first time. We obtained excellent device characteristics and good memory operations of the fabricated n-ch and p-ch MFIS-FET's, in which the memory window and on)'off drain current ratio of typical p-ch memory device were measured to be 1.5 V at V_G of +-5 V and 8 orders-of-magnitude, respectively. We also confirmed by evaluating the gate voltage and gate size dependences of device properties that the fabricated devices showed quantitatively reasonable ferroelectric memory operations.
机译:具有BLT / HfO_2结构的铁电栅FET首次在5英寸规模的Si晶圆上使用完善的基于CMOS的兼容0.8μm的制造工艺制造。我们获得了制造的n-ch和p-ch MFIS-FET的出色的器件特性和良好的存储操作,其中典型p-ch存储器件的存储窗口和开/关漏极电流比在1.5V时测量为1.5V。 V_G分别为+ -5 V和8个数量级。我们还通过评估器件性能对栅极电压和栅极尺寸的依赖性,证实所制造的器件显示出定量合理的铁电存储操作。

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