Boosting first-pass yield: laser-based inspection of solder paste deposits and component placement can dramatically improve first-pass yield

摘要

In-line inspection during surface mount assembly has become increasingly necessary as components shrink, boards get smaller and more complex, and profit margins narrow. Nearly 40 percent of all printed circuit board (PCB) defects are component-related, such as bent leads, missing components and misaligned components. By inspecting boards before reflow, assemblers can lower rework costs and improve process control.