Solder Paste Characteristics that Influence Production Yields

摘要

The purpose of this paper is to present results of designed experiments conducted on the printability of solder paste. Solder paste volume deposited is a key parameter in achieving world-class surface mount soldering results. Experimentation conducted includes a 3 factor 2 level design of experiments. The influence that solder paste flux type, solder alloy particle distribution, and stencil type have on volume of solder pasted deposited in ultra-fine pitch applications have been reported. Results indicate that solder paste flux type and stencil type have significant influence on volume of solder paste deposited.