SOLDER POWDER WITH EXOTHERMIC AND AMORPHOUS CHARACTERISTICS MANUFACTURE METHOD AND SOLDER PASTE MANUFACTURE METHOD AND SOLDER PASTE USING LOW TEMPERATURE BONDING METHOD

摘要

The present invention relates to a solder powder manufacturing method, a solder paste manufacturing method, and a low temperature bonding method using a solder paste, wherein the method comprises: pre-treating a surface of a plating object for removing contaminants or oxides; Forming a nano-multilayered plating layer on the object to be plated using an electrolytic plating method; Peeling the nano multilayer plating layer formed on the object to be plated; And pulverizing the peeled nanostructured multi-layered plating layer. According to the present invention, it is possible to manufacture a micrometer-sized powder paste having a nano-layer, and the size is micro-sized. However, since the powders are alternately stacked as nano-layers, they can be used for low-temperature bonding like nano powder, , There is no risk of fire or human infiltration, it is possible to store it in the atmosphere, and there is no phenomenon of being adhered to adjacent particles at room temperature, and a micrometer-sized powder and nano laminate having a nano- It is possible to achieve a low temperature bonding and a reduction in the ratio of the nano-laminated powder compared to the case of using only the nano-laminated powder, thereby further reducing the price.