Depositing solder paste on electric components - using dosing machine where plungers transfer blobs of paste onto components

摘要

The parent specification described a device for depositing solder paste onto localised points on components used in electric signals to telecommunications. This is now carried out using a frame carrying a stationary plate on which dosers are mounted. A work cylinder lifts a tank contg. solder paste so the dosers ar filler, and the tank is then lowered in synchronisation with dosing plungers which dip into the dosers and pick up the required amt. of paste. The dosing punches are then raised and moved horizontally towards the workpiece while the dosers are refilled by raising then thank to repeat the cycle. The present device is simpler to make and easier to operate than that described in the main patent.