首页> 外文期刊>Acta Horticulturae >Effect of defoliation and wounding on expression of pectic polysaccharide-degrading enzyme genes in immature 'Hiratanenashi' persimmon fruit on the tree
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Effect of defoliation and wounding on expression of pectic polysaccharide-degrading enzyme genes in immature 'Hiratanenashi' persimmon fruit on the tree

机译:脱落与伤害对树木未成熟'Hiratanenashi'柿子果实果糖酶基因表达的影响

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摘要

Immature 'Hiratanenashi' persimmon {Diospyros kaki Thunb.) fruit soften rapidly on the tree after wounding, concomitant with ethylene production. Defoliation promotes the progress of fruit softening and expression of ethylene biosynthesis enzyme genes. To understand fruit softening on the tree in 'Hiratanenashi' persimmon, we analyzed expression of genes for two polygalacturonase (PG), one B-galactosidase (Gal), and one a-arabinofuranosidase (Arf) enzymes in persimmon fruit after wounding with or without defoliation. Wounding with defoliation accelerated fruit softening on the tree more than wounding without defoliation. DkPGl, DkPG2, DkGall and DkArfl in pulp tissue were expressed at the basal level until four days after wounding without defoliation, but increased DkGall and DkArfl expression in the core section of the fruit was observed at four days after wounding. There was a large increase in DkPGl, DkPG2, DkGall and DkArfl expression after six days in both pulp and core sections of fruit. Wounding combined with defoliation induced DkPG2, DkGall and DkArfl gene expression at two or four days after treatment in both pulp and core tissues; DkGall was most highly induced. These results suggest that attachment of leaves to the fruit-bearing shootprevents fruit softening on the tree by delaying the degradation of polysaccharide side chains.
机译:未成熟的'hiratanenashi'柿子{diospyros kaki thunb。)水果在伤害后迅速软化,伴随着乙烯生产。脱落促进果实软化和乙烯生物合成酶基因表达的进展。要在“Hiratanenashi”柿子上的树上软化,我们分析了两种聚半乳糖酶(PG),一种B-半乳糖苷酶(PG),一种B-半乳糖苷酶(GAL)的基因的表达,以及在患有或没有落叶。抗脱落的伤害加速了树上的果实软化,而不是伤害而没有脱落。 DKPGL,DKPG2,DKGALL和DKARFL在纸巾组织的基础上表达,直到伤害4天而没有脱透露,但在伤口后四天观察到果实的核心部分中的DKGALL和DKARFL表达增加。在纸浆和水果芯片的六天后,DKPGL,DKPG2,DKGALL和DKARFL表达大幅增加。在纸浆和核心组织中治疗后两次或四天,伤口与侧渗诱导DKPG2,DKGALL和DKARFL基因表达; DKGALL最诱导。这些结果表明,通过延迟多糖侧链的降解,将叶片与果实射击果实软化在树上。

著录项

  • 来源
    《Acta Horticulturae》 |2018年第1195期|共4页
  • 作者单位

    Faculty of Life and Environmental Science Shimane University Matsue Shimane 690-8504 Japan;

    Department of Horticultural Sciences Agricultural College Guangxi University 100 Daxue Road Nanning Guangxi 530004 China;

    Faculty of Life and Environmental Science Shimane University Matsue Shimane 690-8504 Japan;

    Faculty of Life and Environmental Science Shimane University Matsue Shimane 690-8504 Japan;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 园艺;
  • 关键词

    beta-galactosidase; Diospyros kaki; ethylene; fruit softening;

    机译:β-半乳糖苷酶;Diospyros Kaki;乙烯;水果软化;

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