On the role of macro- and microdistribution factors in the plating of electronic components

摘要

Current and metal distribution on different areas of the cathode surface may be controlled predominantly either by macrodistribution or by microdistribution depending on the aize and shape of surface irregularities which may exist on the cathodic areas of the components of modern electronic devices. This problem has been discussed in the present paper and possible ways to control metal distribution have proposed.