机译:用于晶圆级CSP的高纵横比铜凸块的形状演变
Department of Applied Chemistry Engineering University of Okayama Okayama 700-0082;
Department of Applied Chemistry Engineering University of Okayama Okayama 700-0082;
Department of Chemical Engineering Himeji Institute of Technology Himeji 671-2201;
Department of Applied Chemistry Engineering University of Okayama Okayama 700-0082;
electrodeposition; wafter level CSP; via post; uniformity; mass transfer;
机译:晶圆级CSP用高纵横比铜凸块的形状演变
机译:金饰钉凸点的无掩膜成形为高长宽比的微结构
机译:高纵横比多铜柱倒装芯片互连的疲劳和桥接研究,通过焊点形状建模
机译:无铅晶圆型包装中高速铜柱电镀工艺凸起形状控制
机译:在304不锈钢,镍和铝含量为4%(重量)的铜钨合金气体弧焊和激光束焊接过程中,引力对焊缝形状和组织演变的引力影响。
机译:铜催化的环丙醇开环Csp3-Csp3与(氟)烷基卤的交叉偶联
机译:CSP技术和高纵横比凸块。
机译:无掩模成形金凸块凸块作为高纵横比微结构