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Advanced SiO{sub}2 process technology --study on SiO{sub}2 degradation mechanism and novel oxidation process for highly reliable gate oxide

机译:SIO {SUB} 2的高级SIO {SUB} 2过程技术 - 用于高可靠栅极氧化物的劣化机理和新型氧化过程

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摘要

We investigated the mechanisms of dielectric breakdown and of stress-induced leakage current (SILO) in ultra-thin SiO{sub}2, using newly developed investigation methods. It was found that SiO{sub}2 dielectric breakdown is dominated by generatedtraps which correlate with both injected electrons and holes, and that SILO is related to energy-changeable traps generated in SiO{sub}2.For the suppression of trap generation in SiO{sub}2, we demonstrated that oxygen-radical oxidation has great potential for realizing a highly reliable gate oxide.
机译:我们研究了使用新开发的调查方法的超薄SiO {Sub} 2中的介电击穿和应力诱导的漏电流(筒仓)的机制。 发现SiO {Sub} 2介电击穿由生成的备线支配,该产生有关与喷射的电子和孔相关,并且该筒仓与SiO {Sub}中产生的能量可变的陷阱有关。在SIO中抑制陷阱生成 {Sub} 2,我们证明了氧自由基氧化具有实现高度可靠的栅极氧化物的潜力。

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