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In Situ PL and SPV Monitored Charge Carrier Injection During Metal Assisted Etching of Intrinsic a-Si Layers on c-Si

机译:c-Si上本征a-Si层的金属辅助刻蚀过程中的原位PL和SPV监控电荷载流子注入

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Although hydrogenated amorphous silicon is already widely examined regarding its structural and electronic properties, the chemical etching behavior of this material is only roughly understood. We present a detailed study of the etching properties of intrinsic hydrogenated amorphous silicon, (i)a-Si:H, layers on crystalline silicon, c-Si, within the framework of metal assisted chemical etching (MACE) using silver nanoparticles (Ag NPs). The etching processes are examined by in situ photoluminescence (PL) and in situ surface photovoltage (SPV) measurements, as these techniques allow a monitoring of the hole injection that takes place during MACE. By in situ PL measurements and SEM images, we could interpret the different stages of the MACE process of (i)a-Si:H layers and determine etch rates of (i)a-Si:H, that are found to be influenced by the size of the Ag NPs. In situ PL and in situ SPV measurements both enable researchers to determine when the Ag NPs reach the (i)a-Si:H/c-Si interface. Furthermore, a preferential MACE of (i)a-Si:H versus c-Si is revealed for the first time. This effect could be explained by an interplay of the different thermodynamic and structural properties of the two materials as well as by hole injection during MACE resulting in a field effect passivation. The presented results allow an application of the examined MACE processes for Si nanostructuring applications.
机译:尽管氢化非晶硅已经对其结构和电子性能进行了广泛的研究,但是这种材料的化学蚀刻行为只是粗略了解。我们在使用银纳米颗粒(Ag NPs)的金属辅助化学蚀刻(MACE)框架内,对本征氢化非晶硅(i)a-Si:H在晶体硅c-Si上的蚀刻特性进行了详细研究)。蚀刻过程通过原位光致发光(PL)和原位表面光电压(SPV)测量进行检查,因为这些技术可以监控在MACE期间发生的空穴注入。通过原位PL测量和SEM图像,我们可以解释(i)a-Si:H层的MACE工艺的不同阶段,并确定(i)a-Si:H的蚀刻速率,发现蚀刻速率受到以下因素的影响Ag NP的大小。原位PL和原位SPV测量都使研究人员能够确定Ag NP何时到达(i)a-Si:H / c-Si界面。此外,首次揭示了(i)a-Si:H相对于c-Si的优先MACE。可以通过两种材料不同的热力学和结构特性的相互作用以及在MACE期间进行空穴注入导致场效应钝化来解释这种效应。呈现的结果允许将所检查的MACE工艺应用于硅纳米结构应用。

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