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Etching of a-Si:H on c-Si absorber monitored by in situ photoluminescence measurements

机译:通过原位光致发光测量监测的C-Si吸收剂对A-Si:H的蚀刻

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Interdigitated rear contact concepts for amorphous (a-Si:H)/crystalline (c-Si) silicon heterojunction solar cells require structured amorphous layers of different doping on the rear side [1,2]. Such structures can be achieved by a wet-chemical etching step. A monitoring of the etching process is required since the density of defects at the c-Si surface that are induced by the wet-chemical etching [3] should be minimal to avoid recombination induced losses. Therefore, in situ photoluminescence (PL) was used to investigate the a-Si:H etching velocities of different etching solutions and to monitor defect formation at the c-Si surfaces after the a-Si:H removal. A correlation between the decrease in PL intensity during the progressive etching of the a-Si:H layer and the remaining thickness of the a-Si:H layer as measured by vibrational spectroscopic techniques has been observed. First results on the etching induced defects measured by PL spectra are presented for the investigated etchants. It is thus concluded that in situ PL is ideally suited for fast and straightforward process monitoring of etching processes on c-Si surfaces for photovoltaic applications.
机译:非晶(A-Si:H)/晶体(C-Si)硅杂函数太阳能电池的互连后接触概念需要在后侧的不同掺杂的结构化无定形层[1,2]。这种结构可以通过湿化学蚀刻步骤实现。需要监测蚀刻过程,因为湿化学蚀刻诱导的C-Si表面的缺陷密度应该是最小的,以避免重组诱导的损失。因此,原位光致发光(PL)用于研究不同蚀刻溶液的A-Si:H蚀刻速度,并在A-Si脱离后监测C-Si表面的缺陷形成。已经观察到在A-Si:H层和通过振动光谱技术测量的A-Si:H层的逐步蚀刻期间P1强度的减小与A-Si:H层的剩余厚度之间的相关性。首先展示通过PL光谱测量的蚀刻诱导的缺陷用于研究的蚀刻剂。因此得出结论,原位PL非常适用于用于光伏应用的C-Si表面上的蚀刻工艺的快速和直接的过程监测。

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