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机译:Sn-3.0Ag-0.5Cu纳米复合焊料加固Ni纳米粒子的微观结构和电物理性质在熔化 - 凝固温度范围内加固Ni纳米粒子
Department of Inorganic Chemistry – Functional Materials University of Vienna;
Department of Metal Physics Ivan Franko National University of Lviv;
Department of Metal Physics Ivan Franko National University of Lviv;
Department of Metal Physics Ivan Franko National University of Lviv;
School of Applied Science Mongolian University of Sciences and Technology;
Department of Inorganic Chemistry – Functional Materials University of Vienna;
electrical conductivity; microstructure; Ni nanoparticles; Sn-3.0Ag-0.5Ag; x-ray analysis;
机译:Sn-3.0Ag-0.5Cu纳米复合焊料加固Ni纳米粒子的微观结构和电物理性质在熔化 - 凝固温度范围内加固Ni纳米粒子
机译:NiO纳米粒子回流焊后无铅Sn-3.0Ag-0.5Cu锡膏的组织和力学性能
机译:Fe_2NiO_4纳米颗粒添加到无铅Sn-3.0Ag-0.5Cu焊膏中对回流焊后的组织和力学性能的影响
机译:SN-37PB和SN-3.0AG-0.5CU BGA焊点在极端温度环境下的微观结构演化与力学性能
机译:低温SNBI焊膏的工艺,强度和微观结构分析混合无铅焊球
机译:使用Sn纳米粒子增强焊膏焊接无源部件:对微观结构和关节强度的影响
机译:Ni纳米粒子增强的Sn-3.0Ag-0.5Cu纳米复合钎料在熔体凝固温度范围内的微观结构和电物理性能