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Low-temperature combustion synthesis and UV treatment processed p-type Li:NiOx active semiconductors for high-performance electronics

机译:低温燃烧合成和UV处理加工P型Li:高性能电子器件的NiOx活性半导体

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摘要

Solution-processed thin film transistors (TFTs) in the next generation of large-area flexible electrics not only need oxide semiconductors with high performance but also require them with low-temperature processability. To meet these requirements, we developed a low-temperature method, that is, combining solution combustion synthesis and deep-ultraviolet irradiation to prepare p-type Li-doped NiOx (Li:NiOx) thin films at 150 degrees C. The incorporation of Li into the NiOx matrix significantly improves p-type conductivity of NiOx because the Fermi level (E-F) shifts toward the valence band maximum. To confirm the possible application of Li:NiOx as the channel layer in TFTs, Li:NiOx/ZrO2/ITO was fabricated on each of rigid glass and flexible PET substrates. This is the first report of application of Li:NiOx semiconductor in TFT devices. The field-effect mobility, I-on/I-off and subthreshold swing for rigid and flexible Li-5%:NiOx TFTs are 1.69 and 1.41 cm(2) V-1 s(-1), 8 x 10(6) and 10(5), 0.21 and 0.54 V dec(-1), respectively. Furthermore, the counterclockwise hysteresis of transfer curves is negligible (0.1 V). Thus, the high-performance and cost-effective electronics with low fabrication temperature will definitely contribute to future large-scale flexible and wearable electronics.
机译:溶液处理的薄膜晶体管(TFT)在下一代大面积柔性电气装置中不仅需要具有高性能的氧化物半导体,而且还需要它们具有低温加工性。为了满足这些要求,我们开发了一种低温方法,即结合溶液燃烧合成和深紫外线照射,在150摄氏度下制备p型Li-掺杂的NiOx(Li:NiOx)薄膜。李进入NiOx基质显着提高了NiOx的p型导电性,因为FERMI水平(EF)朝向价带偏移最大。为了确认Li:NiOx作为TFT中的沟道层的可能施加,Li:NiOx / ZrO2 / ITO在刚性玻璃和柔性PET基板中的每一个上制造。这是LI:NIOx半导体在TFT器件中的第一个应用报告。用于刚性和柔性Li-5%:NiOx TFT的现场效应移动性,I-ON / I-OFF和亚阈值摆动为1.69和1.41cm(2)V-1 S(-1),8 x 10(6)分别为10(5),0.21和0.54 V DEC(-1)。此外,转移曲线的逆时针滞后可忽略不计(0.1V)。因此,具有低制造温度的高性能和经济高效的电子肯定会有助于未来的大规模柔性和可穿戴电子设备。

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