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Ultraviolet-assisted annealing for low-temperature solution-processed p-type gallium tin oxide (GTO) transparent semiconductor thin films

机译:用于低温溶液加工的P型镓氧化锡(GTO)透明半导体薄膜的紫外线辅助退火

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摘要

Solution-processed p-type gallium tin oxide (GTO) transparent semiconductor thin films were prepared at a low temperature of 300 degrees C using ultraviolet (UV)-assisted annealing instead of conventional high-temperature annealing (> 500 degrees C). We report the effects of UV irradiation time on the structural, optical, and electrical properties of sol-gel derived GTO thin films and a comparison study of the physical properties of UV -assisted annealed (UVA) and conventional thermally annealed (CTA) GTO thin films. The Ga doping content was fixed at 15 at% in the precursor solution ([Ga]/[Sn] + [Ga] = 15%). After a spin-coating and preheating procedure was performed two times, the dried sol-gel films were heated on a hotplate at 300 degrees C under IN light irradiation for 1-4 h. Each UVA GTO thin film had a dense microstructure and flat free surface and exhibited an average optical transmittance approaching 85.0%. The level of crystallinity, crystallite size, and hole concentration density of the GTO thin films increased with increasing UV irradiation time. In this study, the UVA 4 h thin film samples exhibited the highest hole concentration (9.87 x 10(17) cm(-3)) and the lowest resistivity (1.8 Omega cm) and had a hole mobility of 5.1 cm(2)/Vs.
机译:使用紫外(UV) - 兼容性退火代替常规的高温退火(> 500℃),在300摄氏度的低温下制备溶液处理的p型氧化锡(GTO)透明半导体薄膜。我们报道了UV照射时间对溶胶薄膜的结构,光学和电性质的影响,以及UV亚型母线退火(UVA)物理性质的比较研究和常规的热退火(CTA)GTO薄电影。在前体溶液([Ga] / [Sn] + [Ga] = 15%)中,Ga掺杂含量为15at%。在两次进行旋涂和预热过程之后,将干燥的溶胶 - 凝胶膜在热板上在300℃下在光照射中加热1-4小时。每个UVA GTO薄膜具有致密的微观结构和平自由表面,并且平均光学透射率接近85.0%。随着UV照射时间的增加,GTO薄膜的结晶度,微晶尺寸和空穴浓度密度的水平增加。在该研究中,UVA 4 H薄膜样品显示出最高空穴浓度(9.87×10(17)cm(-3))和最低电阻率(1.8ωcm),并且具有5.1cm(2)/的空穴迁移率/ vs.

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