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Design, Fabrication, and Modeling of an Electric-Magnetic Self-Folding Sheet

机译:电磁自折板的设计,制造和建模

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摘要

A concept recently proposed by the authors is that of a multifield sheet that folds into several distinct shapes based on the applied field, be it magnetic, electric, or thermal. In this paper, the design, fabrication, and modeling of a multifield bifold are presented, which utilize magneto-active elastomer (MAE) to fold along one axis and an electro-active polymer, P(VDF-TrFE-CTFE) terpolymer, to fold along the other axis. In prior work, a dynamic model of self-folding origami was developed, which approximated origami creases as revolute joints with torsional spring-dampers and simulated the effect of magneto-active materials on origami-inspired designs. In this work, the crease stiffness and MAE models are discussed in further detail, and the dynamic model is extended to include the effect of electro-active polymers (EAP). The accuracy of this approximation is validated using experimental data from a terpolymer-actuated origami design. After adjusting crease stiffness within the dynamic model, it shows good correlation with experimental data, indicating that the developed EAP approximation is accurate. With the capabilities of the dynamic model improved by the EAP approximation method, the multifield bifold can be fully modeled. The developed model is compared to the experimental data obtained from a fabricated multifield bifold and is found to accurately predict the experimental fold angles. This validation of the crease stiffness, MAE, and EAP models allows for more complicated multifield applications to be designed with confidence in their simulated performance.
机译:作者最近提出的一个概念是基于所施加的场的多个不同形状折叠成多个不同形状的概念,它是磁,电动或热的。在本文中,提出了多峰位Bifold的设计,制造和建模,其利用磁性活性弹性体(MAE)沿一个轴和电活性聚合物,P(VDF-TRFE-CTFE)三元共聚物折叠至沿着另一个轴折叠。在现有工作中,开发了一种自折叠折纸的动态模型,近似的折纸作为具有扭转弹簧阻尼器的旋转接头,并模拟磁心活性材料对折纸启发设计的影响。在这项工作中,进一步详细讨论折痕刚度和MAE模型,并且动态模型扩展到包括电活性聚合物(EAP)的效果。使用来自三元化的折纸设计的实验数据验证了该近似的准确性。在调整动态模型内的折痕刚度之后,它显示出与实验数据的良好相关性,表明发达的EAP近似是准确的。利用EAP近似方法改善动态模型的能力,可以完全建模多峰位。将开发的模型与由制造的多粒Bifold获得的实验数据进行比较,并且发现精确地预测实验折角。这种折断刚度,MAE和EAP型号的验证允许更复杂的多级应用程序在模拟性能方面以信心为设计。

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