New Method for Determining and Predicting Test Interconnect Pin Current Carrying Capacity

摘要

With new advances in the semiconductor technology, current carrying requirements for electronic packages and interconnects (sockets) are on the rise. Although there are a lot of documented methods for determining current carrying capacity (CCC) of electrical wires, there is no specific industry standard for determining current carrying capacity of socket pins and their contact interface with package balls and pads. This paper presents a new current carrying capacity measurement method, developed specifically to address the challenges of test socket pins and their contact interface with solder balls and pads. In addition, a method for predicting CCC in future test socket pins is presented and correlated to measured data.